Dow DOWSIL™ 3-4170 Dielectric Gel – 362.8kg

SKU: 0002-01-000229

Dow DOWSIL™ 3-4170 Dielectric Gel is a two-component, soft 1:1 mix ratio gel that is used for potting and protecting PCB system assemblies. 362.8kg Key Features Dow DOWSIL™ 3-4170:

  • Clear
  • Fast heat cure
  • Long working time
  • Low viscosity aid process flexibility
  • Impregnation may be successful without vacuum
  • Fast heat cure for increased processing speeds
  • Long working time at RT and low viscosity provide processing flexibility

Size: 362.8kg

Additional information

Manufacturer part no.