DYMAX Ultra Light-Weld 9309-SC See-Cure Light-Cure BGA, CSP Reinforcement Adhesive Clear Blue Gel is a high viscosity, thixotropic adhesive that is used for rapid strengthening and shock absorption for circuit board components, lead frames, ceramics, silicon, and PCB. It cures with exposure to UV/Visible light and changes from blue to clear when fully cured. 300 mL Cartridge.
UV/Light curing adhesive that is used for rapid strengthening of circuit board components.
Size: 300g Cartridge, 30g Syringe (MR)
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