Additional information
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| Size | |
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Dow DOWSIL™ 3-4170 Dielectric Gel – 362.8kg
Dow DOWSIL™ 3-4170 Dielectric Gel is a two-component, soft 1:1 mix ratio gel that is used for potting and protecting PCB system assemblies. 362.8kg Key Features Dow DOWSIL™ 3-4170:
- Clear
- Fast heat cure
- Long working time
- Low viscosity aid process flexibility
- Impregnation may be successful without vacuum
- Fast heat cure for increased processing speeds
- Long working time at RT and low viscosity provide processing flexibility
