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Dow DOWSIL™ 1-4174 is a flowable, one-component, thermally conductive adhesive with high tensile strength and seven mil glass beads. Main uses of this product include bonding integrated circuit substrates, adhering lids and housings, base plates, and heat sinks. 1.5kg
Key Features of Dow DOWSIL™ 1-4174:
Size: 1.5kg Normally ships within: Sold in quantity of: