Dow DOWSIL™ 3-4170 Dielectric Gel

Dow DOWSIL™ 3-4170 Dielectric Gel is a two-component, soft 1:1 mix ratio gel that is used for potting and protecting PCB system assemblies.

Key Features Dow DOWSIL™ 3-4170:

• Clear
• Fast heat cure
• Long working time
• Low viscosity aid process flexibility
• Impregnation may be successful without vacuum
• Fast heat cure for increased processing speeds
• Long working time at RT and low viscosity provide processing flexibility